MPi EVS Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is widely utilized on gold bump and pad wafer tests for display driver, logic, and memory unit. MPI’s cantilever probes would be the corresponding reply to your requires of fi­ne pitch, small pad dimension, substantial pace, less cleaning, multi-DUT, higher pin rely, and ultra-minimal leakage demands. With superb craftsmanship, revolutionary architecture and confirmed methodologies determined by mechanical and electrical simulation/measurement benefits, building MPI the highest cantilever company around the globe.


FCB Probe Card

The FCB Probe Card is easily the most experienced know-how of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of check (COT) demand. FCB is a proven solution for several different semiconductor output assessments from early engineering pilot-runs to high quantity production (HVM). FCB is ready for machine necessitating higher sign integrity probing (SI) and/or electric power integrity probing (PI). Programs consist of chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus much more. FCB guarantees the world’s finest All round cost-of-possession (COO) for numerous DUT purposes.


EVS Probe Card

The EVS Probe Card is undoubtedly an enhancement about the conventional buckling beam probe card. Key characteristics are larger present-day carrying capability (C.C.C.) and lower balanced contact power (BCF), as well as Over-all MEMS-like traits. EVS can certainly fulfill the necessity of Highly developed wafer probing. Exact alignment and fantastic planarity Manage are definitely the important components contributing to stable Speak to resistance. With its potential and overall performance, EVS Probe Card is a really perfect option for Superior probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s Alternative to demand for ever finer pitch. It truly get more info is created for lesser Al pad, and it is ideal for small pitch software with peripheral and whole array sample. With specific alignment and much better planarity Management, Osprey can access bigger productivity by multi-DUT design and style.  The forming wire (FW) variety needle manufactured with MPI’s own micro fabrication procedure not merely delivers large-excellent general performance but will also allows easy needle replacement and shortens sustaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is designed for the demand of reduced force probing. Additionally, it comes with a chance to fulfill substantial C.C.C. and substantial pin counts application. The MEMS procedure guarantees highly consistent needle properties, as well as Exclusive framework design and style enables specific alignment and planarity Management.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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